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| CALIFORNIA MICRO DEVICES PACDT P/Active 1% Tolerance Dual Thevenin Termination Network Features * Minimal ground bounce, crosstalk * Stable 1% absolute tolerance elements * 16 terminating lines per QSOP package * Saves board space and reduces assembly cost Applications * HSTL termination * Thevenin termination * ECL, TTL termination Product Description High speed logic devices like HSTL (High Speed Transceiver Logic) demand unique, high speed bus terminations. The dual Thevenin termination network provides 16 terminating channels per package, and optimizes signal integrity by reducing reflections and ringing. The terminations are available in a range of standard values and are ideal for use in HSTL busses. As seen in the schematic, R1 is typically tied to VCC and serves as a pull-up resistor, while R2 functions as a pulldown resistor and is tied to ground (or the most negative supply voltage). In addition, the equivalent Thevenin resistance (R1 in parallel with R2) should match the impedance of the trace. Ground-bounce and crosstalk are virtually eliminated using a proprietary lead-frame which includes four direct ground connections to the die substrate, as well as four double-bonded connections to VCC, for a total of 8 commons. In addition, the resistors are trimmed to a tight absolute tolerance of 1% which provides tight impedance-matching and results in greatly reduced reflections. This unique proprietary design provides optimal signal integrity. STANDARD VALUES Absolute Tolerance (R1 & R2) TCR Operating Temperature Range Power Rating/Resistor Crosstalk (see Test Circuit) Package 1% 100ppm 0 C to 70 C 100mW 30mV TYP 24 Pin QSOP BUS IMPEDANCE () 47 50 56 68 R1() 94 100 112 136 R2 () CODE 94 100 112 136 001 002 003 004 SCHEMATIC CONFIGURATION 24 VCC 23 21 22 20 19 17 18 16 15 14 13 GND 1 2 3 4 5 6 7 8 9 10 11 12 STANDARD PART ORDERING INFORMATION Package R Code 001 002 003 004 Pin 24 24 24 24 Style QSOP QSOP QSOP QSOP Ordering Part Number Tubes PAC001DTFQ/T PAC002DTFQ/T PAC003DTFQ/T PAC004DTFQ/T Tape & Reel PAC001DTFQ/R PAC002DTFQ/R PAC003DTFQ/R PAC004DTFQ/R Part Marking PAC001DTFQ PAC002DTFQ PAC003DTFQ PAC004DTFQ C1611100 (c) 2000 California Micro Devices Corp. All rights reserved. 215 Topaz Street, Milpitas, California 95035 11/19/2000 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 CALIFORNIA MICRO DEVICES POWER DERATING CURVE PACDT H E 1 H Percent of Rated Power 100 80 60 40 20 0 0 70 Degrees C 125 150 D e B MECHANICAL SPECIFICATIONS Lead Plating Lead Material Tin-Lead Copper Alloy 0.004" (0.102mm) Silicon Molded Epoxy UL94V-0 C A1 A Lead Coplanarity Substrate Material Body Material Flammability L PACKAGE DIMENSIONS, POWER DISSIPATION & ORDERING INFORMATION Package Pins # mm MIN A A1 B C D E e H L PD @ 70C #/tube #/tape & reel 1.35 0.10 0.20 0.18 4.80 3.81 QSOP 16 inches MIN MAX 0.053 0.069 0.004 0.010 0.008 0.012 0.007 0.010 0.189 0.197 0.150 0.157 0.025 BSC 0.228 0.244 0.016 0.050 20 mm MIN 1.35 0.10 0.20 0.18 8.56 2.81 24 inches MIN MAX mm MIN 1.35 0.10 0.20 0.18 8.56 3.81 28 inches MIN MAX 0.069 0.010 0.012 0.010 0.244 0.157 mm MIN 1.35 0.10 0.20 0.18 9.80 3.81 inches MIN MAX 0.053 0.069 0.004 0.010 0.008 0.012 0.007 0.010 0.386 0.393 0.150 0.157 0.025 BSC 0.228 0.244 0.016 0.050 MAX 1.75 0.25 0.30 0.25 5.00 3.98 MAX 1.75 0.25 0.30 0.25 8.73 3.98 MAX 1.75 0.25 0.30 0.25 8.73 3.98 MAX 1.75 1.25 0.30 0.25 9.98 3.98 0.053 0.069 0.004 0.010 0.008 0.012 0.007 0.010 0.337 0.344 0.150 0.157 0.025 BSC 0.228 0.244 0.016 0.050 0.053 0.004 0.008 0.007 0.337 0.150 .64 BSC 5.79 0.40 6.19 1.27 .64 BSC 5.79 0.40 6.19 1.27 .64 BSC 5.79 0.40 6.19 1.27 0.025BSC 0.228 0.016 0.244 0.050 0.64 BSC 5.79 0.40 6.20 1.27 0.75W 99 pcs 2,500 pcs 1.00W 56 pcs 2,500 pcs 1.00W 56 pcs 2,500 pcs 1.00W 56 pcs 2,500 pcs (c)2000 California Micro Devices Corp. All rights reserved. 2 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 11/19/2000 |
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